MosChip Technologies announced that it will launch its new Product Xcelerate™ Blueprints at Embedded World North America, introducing a unified solutions suite that advances how OEMs design intelligent, connected products in the AI-Led Product Era.

At MosChip Booth [#4068], attendees will experience Product Xcelerate™ Blueprints in action. [Reserve your slot] for an exclusive demonstration.

As OEMs accelerate intelligent product development, integration challenges persist across hardware, software, and digital & AI lifecycles.

MosChip’s Integrated Engineering approach eliminates these barriers – aligning hardware, embedded software, digital and AI engineering design under a single, co-engineered lifecycle.

ProductXcelerate™ Blueprints are pre-validated, SMARC-aligned, vertical-ready reference designs that unify validated hardware platforms, embedded software stacks, MosChip DigitalSky GenAIoT™ modules, and AgenticSky™ cores – built to meet compliance, interoperability, and scalability requirements, enabling OEMs to design once, certify once, and scale confidently across product lines.

MosChip DigitalSky GenAIoT™ delivers connectivity and intelligence through edge-cloud orchestration, analytics, and intelligent automation, while AgenticSky™ cores (VisionCore, HMICore, WearableCore, ControllerCore)introduce Agentic AI traits – goal-orientation, adaptiveness, and autonomy – allowing machines, devices, and edge systems to sense, decide, and act predictably in the field.

Together, they define a seamless path from hardware to agentic AI, helping engineering teams accelerate development, simplify validation, and ensure long-term reliability.

Key Highlights

• Integrated by Design: Unified hardware, software, digital, and AI lifecycle for next-gen product development
• Pre-Validated & Vertical-Ready: SMARC-class modular design built for compliance and reuse
• AI-Infused Architecture: DigitalSky GenAIoT™ for connectivity and intelligence; AgenticSky™ for adaptiveness and autonomy
• Lifecycle-Continuous: OTA updates, traceability, and proactive optimization built in

These blueprints are designed to help OEMs cut integration cycles, reduce compliance risk, and accelerate product releases across generations.

“We’re bringing a modular, integrated engineering model to product development – pre-validated, reconfigurable, and built on stackable design blocks,” said Vishal Patil, Senior Vice President – Product Engineering BU at MosChip. “By integrating leading hardware ecosystems with embedded software stacks, DigitalSkyGenAIoT™ modules, and AgenticSky™ cores, we’re enabling OEMs to assemble and evolve next-generation products faster than ever.”

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